Electronics Forum | Wed Apr 26 09:48:32 EDT 2006 | patrickbruneel
Checkout this link http://www.rohsusa.com/ any comments on this??
Electronics Forum | Mon Jul 28 14:30:22 EDT 2008 | grics
Take a look at this. Remember, these are only guidlines and can not replace any paste specs. As Real Chunks said, a profiler will be of HUGE help. We use this to determine what our top side temps are and to see if we have any problems with heat sen
Electronics Forum | Sat Aug 02 08:06:11 EDT 2008 | pcbbuilders
Is there a limit to the time that most components can stay at temperatures around 130-200 deg c? if i slow the time, the first 4 zones will be at this temp for about 5 minutes in no lead process. i am concerned that some chips wont be rated at this t
Electronics Forum | Mon Aug 04 09:30:16 EDT 2008 | grics
If you have concerns, you can look at the datasheet for each component or contact one of their application or materials engineers and find out what the components are rated for...process-wise. IE, how long can I be in the oven with this part, at what
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Fri Dec 23 23:29:17 EST 2005 | azbvc
Slaine, thank you for sharing..
Electronics Forum | Tue Dec 15 14:38:23 EST 2020 | emeto
I have done it different ways on different equipment. 1. Remove alloy one from the machine. Add alloy two only. and use it.For next board, do the same. 2. There are machines with separate sections for PB and PC-Free, so pots are away from each other
